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Sometimes, the bond can get corrupted due to SDK updates. In those cases, Agent should detect that the bonding is corrupted and offer the user to re-pair the halves.
This needs firmware cooperation: new bit in the device state?
Sometimes, the bond can get corrupted due to SDK updates. In those cases, Agent should detect that the bonding is corrupted and offer the user to re-pair the halves.
This needs firmware cooperation: new bit in the device state?